Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2003-03-04 |
| 6193905 | Immersion cooling coolant | Mitsutaka Yamada, Kishio Yokouchi, Koichi Niwa | 2001-02-27 |
| 6156259 | Method of manufacturing piezoelectric materials | Motoyuki Nishizawa, Mineharu Tsukada, Kaoru Hashimoto | 2000-12-05 |
| 6097412 | Ink jet printer head and method for fabricating the same including a piezoelectric device with a multilayer body having a pair of high rigidity plates provided on the side walls | Mineharu Tsukada, Koji Omote, Masaharu Hida, Motoyuki Nishizawa, Kazuaki Kurihara | 2000-08-01 |
| 6025258 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2000-02-15 |
| 5962955 | Piezoelectric device and method for fabricating the same, and ink jet printer head and method for fabricating the same | Mineharu Tsukada, Koji Omote, Masaharu Hida, Motoyuki Nishizawa, Kazuaki Kurihara | 1999-10-05 |
| 5906481 | Piezoelectric fluid pump | Kazuki Ogawa, Yuji Yoshida, Motoyuki Nishizawa, Akio Yano, Akihiko Miyaki +4 more | 1999-05-25 |
| 5683529 | Process of producing aluminum nitride multiple-layer circuit board | Hiroshi Makihara, Koji Omote, Mineharu Tsukada | 1997-11-04 |
| 5659004 | Epoxy resin composition | Yukio Takigawa, Yoshihiro Nakata, Shigeaki Yagi, Norio Sawatari | 1997-08-19 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +6 more | 1997-07-01 |
| 5629269 | Process for forming oxide superconducting films with a plurality of metal buffer layers | Kazunori Yamanaka, Takuya Uzumaki, Koichi Niwa | 1997-05-13 |
| 5593526 | Process for preparing a multi-layer wiring board | Kishio Yokouchi, Hiroshi Kamezaki, Masato Wakamura, Koichi Niwa | 1997-01-14 |
| 5585332 | Process for preparing a perovskite Bi-containing superconductor film | Atsushi Tanaka, Koichi Niwa | 1996-12-17 |
| 5458709 | Process for manufacturing multi-layer glass ceramic substrate | Hiroshi Kamezaki, Masato Wakamura, Kishio Yokouchi | 1995-10-17 |
| 5443786 | Composition for the formation of ceramic vias | Hiromitsu Yokoyama, Koji Omote, Hitoshi Suzuki, Mineharu Tsukada, Koichi Niwa | 1995-08-22 |
| 5349499 | Immersion cooling coolant and electronic device using this coolant | Mitsutaka Yamada, Kishio Yokouchi, Koichi Niwa | 1994-09-20 |
| 5312803 | Process for producing Bi- and Pb-containing oxide superconducting wiring films | Atsushi Tanaka, Kazunori Yamanaka, Koichi Niwa | 1994-05-17 |
| 5306702 | Process for producing Bi-Pb-Sr-Ca-Cu-O superconducting films | Atsushi Tanaka, Koichi Niwa | 1994-04-26 |
| 5287620 | Process of producing multiple-layer glass-ceramic circuit board | Hitoshi Suzuki, Wataru Yamagishi, Koichi Niwa, Kaoru Hashimoto | 1994-02-22 |
| 5286713 | Method for manufacturing an oxide superconducting circuit board by printing | Hiromitsu Yokoyama, Yoshihiko Imanaka, Kazunori Yamanaka, Koichi Niwa, Takuya Uzumaki +2 more | 1994-02-15 |
| 5275889 | Multi-layer wiring board | Kishio Yokouchi, Hiroshi Kamezaki, Masato Wakamura, Koichi Niwa | 1994-01-04 |
| 5196384 | Method for preparing green sheets | Hiroshi Kamezaki, Masato Wakamura, Kishio Yokouchi, Yoshihiko Imanaka | 1993-03-23 |
| 5141917 | Multilayer deposition method for forming Pb-doped Bi-Sr-Ca-Cu-O Superconducting films | Atsushi Tanaka, Koichi Niwa | 1992-08-25 |
| 5081070 | Superconducting circuit board and paste adopted therefor | Hiromitsu Yokoyama, Yoshihiko Imanaka, Kazunori Yamanaka, Koichi Niwa, Takuya Uzumaki +2 more | 1992-01-14 |
| 5049541 | Process for preparing superconductor | Takuya Uzumaki, Kazunori Yamanaka, Koichi Niwa | 1991-09-17 |