Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058562 | Wiring substrate and method of manufacturing the same | — | 2011-11-15 |
| 7712649 | Using a simultaneously tilting and moving bonding apparatus | — | 2010-05-11 |
| 7432602 | Semiconductor device | — | 2008-10-07 |
| 7375433 | Semiconductor device packaging substrate and semiconductor device packaging structure | — | 2008-05-20 |
| 5654590 | Multichip-module having an HDI and a temporary supporting substrate | — | 1997-08-05 |
| 5633532 | Semiconductor device interconnection | Tuyosi Sohara, Hirohisa Matsuki | 1997-05-27 |
| 5521122 | Process of manufacturing a multichip module using a temporary support base | — | 1996-05-28 |