Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6476503 | Semiconductor device having columnar electrode and method of manufacturing same | Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Ryuji Nomoto +3 more | 2002-11-05 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara, Toshio Hamano +5 more | 2002-10-29 |
| 6462424 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure | Masaaki Seki, Katsuhiro Hayashida, Toshio Hamano | 2002-10-08 |
| 6459161 | Semiconductor device with connection terminals in the form of a grid array | Masayoshi Hirata, Yasuhiro Suzuki, Tetsuya Hiraoka | 2002-10-01 |
| 6433418 | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism | Tetsuya Fujisawa, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki, Masaki Waki +4 more | 2002-08-13 |
| 6383842 | Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom | Akira Takashima, Shinichirou Taniguchi | 2002-05-07 |
| 6348728 | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer | Yoshitaka Aiba, Toshio Hamano | 2002-02-19 |
| 6333564 | Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes | Yoshitsugu Katoh, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota +6 more | 2001-12-25 |
| 6316838 | Semiconductor device | Kaname Ozawa, Hayato Okuda, Tetsuya Hiraoka, Yuji Akashi, Akira Okada +1 more | 2001-11-13 |
| 6288444 | Semiconductor device and method of producing the same | Mitsuo Abe, Yoshihiro Kubota, Yoshitsugu Katoh, Michio Hayakawa, Ryuji Nomoto +3 more | 2001-09-11 |
| 6165819 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure | Masaaki Seki, Katsuhiro Hayashida, Toshio Hamano | 2000-12-26 |
| 6094356 | Semiconductor device and semiconductor device module | Tetsuya Fujisawa, Kazuhiko Mitobe, Katsuhiro Hayashida, Masaaki Seki, Seiichi Orimo +1 more | 2000-07-25 |
| 6084309 | Semiconductor device and semiconductor device mounting structure | Toyoshige Kawashima, Tetsuya Fujisawa | 2000-07-04 |
| 6060768 | Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame | Katsuhiro Hayashida, Tadashi Uno, Tetsuya Fujisawa, Masaki Waki | 2000-05-09 |
| 5984699 | Method of fabricating a semiconductor device | Masaki Waki, Katsuhiro Hayashida, Tadashi Uno, Kazuhiko Mitobe, Tetsuya Fujisawa | 1999-11-16 |
| 5842628 | Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method | Ryuji Nomoto, Kazuto Tsuji, Junichi Kasai | 1998-12-01 |
| 5821613 | Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereof | Akira Takashima, Shinichirou Taniguchi | 1998-10-13 |
| 5801439 | Semiconductor device and semiconductor device unit for a stack arrangement | Tetsuya Fujisawa, Junichi Kasai, Masataka Mizukoshi, Kosuke Otokita, Hiroshi Yoshimura +4 more | 1998-09-01 |
| 5786985 | Semiconductor device and semiconductor device unit | Norio Taniguchi, Junichi Kasai, Kazuto Tsuji, Michio Sono, Masanori Yoshimoto +5 more | 1998-07-28 |
| 5773313 | Semiconductor device and method of producing the same | Junichi Kasai | 1998-06-30 |
| 5760471 | Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package | Tetsuya Fujisawa, Junichi Kasai, Masataka Mizukoshi, Kousuke Otokita, Hiroshi Yoshimura +4 more | 1998-06-02 |
| 5728601 | Process for manufacturing a single in-line package for surface mounting | Masanori Yoshimoto | 1998-03-17 |
| 5637915 | Semiconductor device affixed to an upper and a lower leadframe | Junichi Kasai, Masanori Yoshimoto, Kouichi Takeshita | 1997-06-10 |
| 5519251 | Semiconductor device and method of producing the same | Junichi Kasai | 1996-05-21 |
| 5508565 | Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package | Atsushi Hatakeyama, Fumio Baba, Junichi Kasai | 1996-04-16 |