Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6207477 | Semiconductor device having a ball grid array and a fabrication process thereof | Toshiyuki Motooka, Ryuji Nomoto, Toshimi Kawahara, Junichi Kasai | 2001-03-27 |
| 6159770 | Method and apparatus for fabricating semiconductor device | Masafumi Tetaka, Shinichiro Maki, Nobuo Ohyama, Seiichi Orimo, Hideharu Sakoda +8 more | 2000-12-12 |
| 6072239 | Device having resin package with projections | Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto, Masanori Onodera +1 more | 2000-06-06 |
| 6069408 | Semiconductor device and method of manufacturing semiconductor device | Toshiyuki Honda, Akihiro Oku, Takanori Watanabe, Kazuto Tsuji | 2000-05-30 |
| 6025650 | Semiconductor device including a frame terminal | Kazuto Tsuji, Hideharu Sakoda, Ryuuji Nomoto, Eiji Watanabe, Seiichi Orimo +2 more | 2000-02-15 |
| 5930603 | Method for producing a semiconductor device | Kazuto Tsuji, Seiichi Orimo, Ryuji Nomoto, Masanori Onodera, Hideharu Sakoda | 1999-07-27 |
| 5904506 | Semiconductor device suitable for testing | Kazuto Tsuji | 1999-05-18 |
| 5891758 | Semiconductor device and method for manufacturing semiconductor device | Toshiyuki Honda, Akihiro Oku, Takanori Watanabe, Kazuto Tsuji | 1999-04-06 |
| 5808357 | Semiconductor device having resin encapsulated package structure | Hideharu Sakoda, Kazuto Tsuji | 1998-09-15 |
| 5804468 | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Kazuto Tsuji, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano +5 more | 1998-09-08 |
| 5767527 | Semiconductor device suitable for testing | Kazuto Tsuji | 1998-06-16 |
| 5750421 | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device | Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more | 1998-05-12 |
| 5736428 | Process for manufacturing a semiconductor device having a stepped encapsulated package | Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more | 1998-04-07 |
| 5666064 | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device | Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more | 1997-09-09 |
| 5656550 | Method of producing a semicondutor device having a lead portion with outer connecting terminal | Kazuto Tsuji, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo +2 more | 1997-08-12 |
| 5654243 | Process for fabricating a semiconductor device in a resin package housed in a frame having high conductivity | Kazuto Tsuji | 1997-08-05 |
| 5625222 | Semiconductor device in a resin package housed in a frame having high thermal conductivity | Kazuto Tsuji | 1997-04-29 |
| 5569625 | Process for manufacturing a plural stacked leadframe semiconductor device | Kazuto Tsuji, Junichi Kasai, Hideharu Sakoda | 1996-10-29 |
| 5521432 | Semiconductor device having improved leads comprising palladium plated nickel | Kazuto Tsuji, Junichi Kasai, Michio Sono | 1996-05-28 |
| 5497032 | Semiconductor device and lead frame therefore | Kazuto Tsuji, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano +5 more | 1996-03-05 |
| 5475259 | Semiconductor device and carrier for carrying semiconductor device | Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma +2 more | 1995-12-12 |
| 5440170 | Semiconductor device having a die pad with rounded edges and its manufacturing method | Kazuto Tsuji, Junichi Kasai | 1995-08-08 |
| 5399804 | Semiconductor device and method of producing the same | Kazuto Tsuji, Junichi Kasai, Hideharu Sakoda | 1995-03-21 |
| 5246492 | Paint composition and coating product | Masamichi Arima, Tetsuo Masuno | 1993-09-21 |
| 4742692 | Method of air-conditioning and system for the same | Tadashi Gotoh, Masanori Yamakawa, Masakazu Matsumoto, Hisashi Yamamoto | 1988-05-10 |