Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5831332 | Semiconductor package for surface mounting | Michio Sono, Junichi Kasai, Masanori Yoshimoto, Kouji Saito | 1998-11-03 |
| 5808357 | Semiconductor device having resin encapsulated package structure | Hideharu Sakoda, Yoshiyuki Yoneda | 1998-09-15 |
| 5804468 | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano +5 more | 1998-09-08 |
| 5786985 | Semiconductor device and semiconductor device unit | Norio Taniguchi, Junichi Kasai, Michio Sono, Masanori Yoshimoto, Katsuhiro Hayashida +5 more | 1998-07-28 |
| 5767527 | Semiconductor device suitable for testing | Yoshiyuki Yoneda | 1998-06-16 |
| 5750421 | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device | Junichi Kasai, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1998-05-12 |
| 5736428 | Process for manufacturing a semiconductor device having a stepped encapsulated package | Junichi Kasai, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1998-04-07 |
| 5703398 | Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device | Michio Sono, Hideharu Sakoda, Yoshimi Suzuki, Masao Sakuma | 1997-12-30 |
| 5684675 | Semiconductor device unit having holder | Norio Taniguchi, Junichi Kasai, Michio Sono, Masanori Yoshimoto | 1997-11-04 |
| 5666064 | Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device | Junichi Kasai, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1997-09-09 |
| 5656550 | Method of producing a semicondutor device having a lead portion with outer connecting terminal | Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe, Seiichi Orimo +2 more | 1997-08-12 |
| 5654243 | Process for fabricating a semiconductor device in a resin package housed in a frame having high conductivity | Yoshiyuki Yoneda | 1997-08-05 |
| 5637923 | Semiconductor device, carrier for carrying semiconductor device | Junichi Kasai, Norio Taniguchi, Takashi Mashiko, Masao Sakuma | 1997-06-10 |
| 5625222 | Semiconductor device in a resin package housed in a frame having high thermal conductivity | Yoshiyuki Yoneda | 1997-04-29 |
| 5574310 | Semiconductor package for surface mounting with reinforcing members on support legs | Michio Sono, Junichi Kasai, Masanori Yoshimoto, Kouji Saito | 1996-11-12 |
| 5569625 | Process for manufacturing a plural stacked leadframe semiconductor device | Yoshiyuki Yoneda, Junichi Kasai, Hideharu Sakoda | 1996-10-29 |
| 5521432 | Semiconductor device having improved leads comprising palladium plated nickel | Yoshiyuki Yoneda, Junichi Kasai, Michio Sono | 1996-05-28 |
| 5497032 | Semiconductor device and lead frame therefore | Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano +5 more | 1996-03-05 |
| 5475259 | Semiconductor device and carrier for carrying semiconductor device | Junichi Kasai, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo +2 more | 1995-12-12 |
| 5451815 | Semiconductor device with surface mount package adapted for vertical mounting | Norio Taniguchi, Junichi Kasai, Michio Sono | 1995-09-19 |
| 5440170 | Semiconductor device having a die pad with rounded edges and its manufacturing method | Yoshiyuki Yoneda, Junichi Kasai | 1995-08-08 |
| 5403776 | Process of using a jig to align and mount terminal conductors to a semiconductor plastic package | Tetsuya Hiraoka, Tsuyoshi Aoki, Junichi Kasai | 1995-04-04 |
| 5399804 | Semiconductor device and method of producing the same | Yoshiyuki Yoneda, Junichi Kasai, Hideharu Sakoda | 1995-03-21 |
| 5293064 | Lead frame and method of manufacturing a semiconductor device | Masanori Yoshimoto, Masao Sakuma, Kouichi Takeshita | 1994-03-08 |
| 5293072 | Semiconductor device having spherical terminals attached to the lead frame embedded within the package body | Tetsuya Hiraoka, Tsuyoshi Aoki, Junichi Kasai | 1994-03-08 |