Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6025258 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2000-02-15 |
| 5978222 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 1999-11-02 |
| 5937277 | Semiconductor device with reliable electrodes of projecting shape and method of forming same | Tatsuharu Matsuda, Masaharu Minamizawa, Toshiyuki Motooka | 1999-08-10 |
| 5889333 | Semiconductor device and method for manufacturing such | Masashi Takenaka, Junichi Kasai, Taturou Yamashita | 1999-03-30 |
| 5831441 | Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device | Toshiyuki Motooka, Syuichirou Takahasi, Tatsuharu Matsuda, Kunio Kodama, Joji Fujimori +3 more | 1998-11-03 |
| 5801439 | Semiconductor device and semiconductor device unit for a stack arrangement | Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Kosuke Otokita, Hiroshi Yoshimura +4 more | 1998-09-01 |
| 5760471 | Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package | Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Kousuke Otokita, Hiroshi Yoshimura +4 more | 1998-06-02 |
| 5729435 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 1998-03-17 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +6 more | 1997-07-01 |
| 5637535 | Semiconductor device with reliable electrodes of projecting shape and method of forming same | Tatsuharu Matsuda, Masaharu Minamizawa, Toshiyuki Motooka | 1997-06-10 |
| 5578525 | Semiconductor device and a fabrication process thereof | — | 1996-11-26 |
| 5521435 | Semiconductor device and a fabrication process thereof | — | 1996-05-28 |
| 5297006 | Three-dimensional multi-chip module | — | 1994-03-22 |
| 4618879 | Semiconductor device having adjacent bonding wires extending at different angles | Teiichi Endo | 1986-10-21 |