Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7514295 | Method for processing a base that includes connecting a first base to a second base with an insulating film | Nobuhiro Imaizumi, Yoshikatsu Ishizuki | 2009-04-07 |
| 7485962 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Kanae Nakagawa, Kazuo Teshirogi | 2009-02-03 |
| 7432114 | Semiconductor device manufacturing method | Kazuo Teshirogi, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo | 2008-10-07 |
| 7402461 | Method of connecting base materials | Nobuhiro Imaizumi, Taiji Sakai | 2008-07-22 |
| 7355290 | Interposer and method for fabricating the same | Takeshi Shioga, Yoshikatsu Ishizuki, Kanae Nakagawa, Taiji Sakai, John David Baniecki +1 more | 2008-04-08 |
| 7049229 | Method of fabricating semiconductor device and semiconductor device | Koji Omote | 2006-05-23 |
| 6979644 | Method of manufacturing electronic circuit component | Koji Omote, Osamu Taniguchi | 2005-12-27 |
| 6943447 | Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer | Yoshikatsu Ishizuki, Nobuyuki Hayashi, Yasuo Yamagishi | 2005-09-13 |
| 6896998 | Pattern forming method | — | 2005-05-24 |
| 6893681 | Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same | Nawalage Cooray, Kanae Nakagawa | 2005-05-17 |
| 6806118 | Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure | Keishiro Okamoto, Yasuo Yamagishi | 2004-10-19 |
| 6773947 | Method of manufacturing semiconductor device including an opening formed by a laser | — | 2004-08-10 |
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Hirohisa Matsuki, Hiroyuki Matsui, Eiji Yoshida, Takao Ohno, Koki Otake +3 more | 2004-05-11 |
| 6580169 | Method for forming bumps, semiconductor device, and solder paste | Seiki Sakuyama, Yasuo Yamagishi | 2003-06-17 |
| 6535002 | IC socket, a test method using the same and an IC socket mounting mechanism | Makoto Haseyama, Shigeyuki Maruyama, Futoshi Fukaya | 2003-03-18 |
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2003-03-04 |
| 6518163 | Method for forming bumps, semiconductor device, and solder paste | Seiki Sakuyama, Yasuo Yamagishi | 2003-02-11 |
| 6347037 | Semiconductor device and method of forming the same | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +3 more | 2002-02-12 |
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Hirohisa Matsuki, Fumihiko Taniguchi, Kunio Kodama, Eiji Watanabe, Hiroyuki Matsui | 2002-02-05 |
| 6319810 | Method for forming solder bumps | Masayuki Ochiai, Yasuo Yamagishi, Ichiro Yamaguchi, Masahiro Yoshikawa, Koki Otake +1 more | 2001-11-20 |
| 6229320 | IC socket, a test method using the same and an IC socket mounting mechanism | Makoto Haseyama, Shigeyuki Maruyama, Futoshi Fukaya | 2001-05-08 |
| 6184133 | Method of forming an assembly board with insulator filled through holes | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 2001-02-06 |
| 6090301 | Method for fabricating bump forming plate member | Ichiro Yamaguchi, Masahiro Yoshikawa, Koki Otake, Junichi Kasai | 2000-07-18 |
| 6088233 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Toshio Hamano, Masaharu Minamizawa, Masashi Takenaka +1 more | 2000-07-11 |
| 6063640 | Semiconductor wafer testing method with probe pin contact | Hidehiko Akasaki, Masao Nakano, Yasuhiro Fujii, Shinnosuke Kamata, Makoto Yanagisawa +4 more | 2000-05-16 |