Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7378745 | Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns | Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera +4 more | 2008-05-27 |
| 7323238 | Printed circuit board having colored outer layer | Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Akimori Hayashi +1 more | 2008-01-29 |