Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888808 | System in package integrating a plurality of semiconductor chips | Junichi Iwasaki | 2011-02-15 |
| 7378745 | Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns | Akimori Hayashi, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera, Tadashi Murai +4 more | 2008-05-27 |
| 7323238 | Printed circuit board having colored outer layer | Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Tadashi Murai +1 more | 2008-01-29 |
| 6379996 | Package for semiconductor chip having thin recess portion and thick plane portion | — | 2002-04-30 |
| 6150615 | Economical package with built-in end resistor used for semiconductor device and process of fabrication | — | 2000-11-21 |
| 6111311 | Semiconductor device and method of forming the same | — | 2000-08-29 |
| 6028358 | Package for a semiconductor device and a semiconductor device | — | 2000-02-22 |
| 5977633 | Semiconductor device with metal base substrate having hollows | Hiroyuki Uchida | 1999-11-02 |
| 5889324 | Package for a semiconductor device | — | 1999-03-30 |
| 5889325 | Semiconductor device and method of manufacturing the same | Hiroyuki Uchida | 1999-03-30 |
| 5866942 | Metal base package for a semiconductor device | Katsuhiko Suzuki, Akira Haga, Isamu Sorimachi, Hiroyuki Uchida | 1999-02-02 |
| 5844307 | Plastic molded IC package with leads having small flatness fluctuation | Akira Haga | 1998-12-01 |
| 5811876 | Semiconductor device with film carrier package structure | Akira Haga | 1998-09-22 |
| 5783426 | Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same | Katsuhiko Suzuki, Isamu Sorimachi, Akira Haga, Hiroyuki Uchida | 1998-07-21 |
| 5600179 | Package for packaging a semiconductor device suitable for being connected to a connection object by soldering | — | 1997-02-04 |