Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199053 | Electronic device and semiconductor device | Shuuichi Kariyazaki | 2025-01-14 |
| 12165995 | Designing method and semiconductor device | — | 2024-12-10 |
| 12009309 | Semiconductor device having a plurality of semiconductor layers covering an emission layer | — | 2024-06-11 |
| 11749597 | Semiconductor device | — | 2023-09-05 |
| 11437341 | Semiconductor device | — | 2022-09-06 |
| 11431378 | Semiconductor device | — | 2022-08-30 |
| 11177235 | Semiconductor device with improved signal transmission characteristics | — | 2021-11-16 |
| 11171112 | Semiconductor device | — | 2021-11-09 |
| 11171083 | Semiconductor device | — | 2021-11-09 |
| 10809470 | Electronic device and method of manufacturing the same | Kazuaki TSUCHIYAMA, Motoo Suwa | 2020-10-20 |
| 10403569 | Semiconductor device | — | 2019-09-03 |
| 10347552 | Semiconductor device | Toshihiko Ochiai, Shuuichi Kariyazaki, Yuji Kayashima, Tsuyoshi Kida | 2019-07-09 |
| 10090881 | Semiconductor device | — | 2018-10-02 |
| 10027311 | Semiconductor device | Wataru Shiroi | 2018-07-17 |
| 9917026 | Semiconductor device | Toshihiko Ochiai, Shuuichi Kariyazaki, Yuji Kayashima, Tsuyoshi Kida | 2018-03-13 |
| 9620447 | Semiconductor device | Shuuichi Kariyazaki | 2017-04-11 |
| 9560762 | Semiconductor device and circuit board | — | 2017-01-31 |
| 9461016 | Semiconductor device | Shuuichi Kariyazaki, Wataru Shiroi, Kenichi Kuboyama | 2016-10-04 |
| 9312216 | Semiconductor device with semiconductor chip and wiring layers | Shuuichi Kariyazaki | 2016-04-12 |
| 9035450 | Semiconductor device and interconnect substrate | Shuuichi Kariyazaki | 2015-05-19 |
| 9006910 | Interconnection structure | — | 2015-04-14 |
| 8373263 | Interconnection structure and its design method | — | 2013-02-12 |
| 8253421 | Impedance measurement method and impedance measurement device | — | 2012-08-28 |
| 8104013 | Design method of semiconductor package substrate to cancel a reflected wave | — | 2012-01-24 |
| 7378745 | Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns | Akimori Hayashi, Katsunobu Suzuki, Makoto Nakagoshi, Naoko Sera, Tadashi Murai +4 more | 2008-05-27 |