MT

Masashi Totokawa

DE Denso: 13 patents #859 of 11,792Top 8%
HI Harima Chemicals, Incorporated: 2 patents #40 of 188Top 25%
UL Ulvac: 1 patents #339 of 680Top 50%
Overall (All Time): #379,410 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
10272491 Soft magnetic member and manufacturing method of soft magnetic member Eiichi Kobayashi, Kunihiro Kodama, Satoshi Takeuchi 2019-04-30
10252338 Method of manufacturing sintering diffusion joining member and manufacturing apparatus of the same Eiichi Kobayashi, Kunihiro Kodama 2019-04-09
8703517 Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer Atsushi Taya, Katsuhiko Kanamori 2014-04-22
8603920 Manufacturing method of semiconductor device including etching step Katsuhiko Kanamori, Hiroshi Tanaka 2013-12-10
8151649 Physical quantity sensor device and method of manufacturing the same Masao Naito, Akihiro Takeichi 2012-04-10
7807073 Conductor composition, a mounting substrate and a mounting structure utilizing the composition Yuji Ootani, Hirokazu Imai, Akira Shintai 2010-10-05
7524893 Conductive adhesive Nobuto Terada, Naoto Shioi, Yasunori Ninomiya 2009-04-28
7458150 Method of producing circuit board Yasunori Ninomiya 2008-12-02
7357883 Conductive adhesive, method of producing the same, and bonding method Yasunori Ninomiya, Hirokazu Imai, Yukinori Migitaka 2008-04-15
7276185 Conductor composition, a mounting substrate and a mounting structure utilizing the composition Yuji Ootani, Hirokazu Imai, Akira Shintai 2007-10-02
7070829 Production method of gas sensor Yorishige Matsuba, Yoshihisa Misawa, Hideyuki Gotoh, Katsuhisa Osako, Masaaki Oda +3 more 2006-07-04
7068142 Pressure-sensitive resistor and pressure-sensitive sensor using the same Tomoyasu Watanabe, Kenichi Yanai, Yuuichi Sekine 2006-06-27
6913947 Multi-layer circuit board and method of manufacturing the same 2005-07-05