Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12000019 | Gold powder, production method for gold powder, and gold paste | Toshinori Ogashiwa | 2024-06-04 |
| 11626334 | Through-hole sealing structure | Toshinori Ogashiwa, Yuya Sasaki | 2023-04-11 |
| 10870151 | Structure and method for sealing through-hole, and transfer substrate for sealing through-hole | Toshinori Ogashiwa, Yuya Sasaki, Kenichi Inoue | 2020-12-22 |
| 10366963 | Noble metal paste for bonding of semiconductor element | Nobuyuki Akiyama, Katsuji Inagaki, Toshinori Ogashiwa | 2019-07-30 |
| 10125015 | Package production method and package produced by the method | Toshinori Ogashiwa, Yuya Sasaki | 2018-11-13 |
| 9561952 | Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member | Toshinori Ogashiwa, Yuya Sasaki | 2017-02-07 |
| 9539671 | Precious metal paste for bonding semiconductor element | Nobuyuki Akiyama, Katsuji Inagaki, Toshinori Ogashiwa | 2017-01-10 |
| 8962471 | Bump, method for forming the bump, and method for mounting substrate having the bump thereon | Toshinori Ogashiwa | 2015-02-24 |
| 8558433 | Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device | Toshinori Ogashiwa, Yoji Nagano | 2013-10-15 |
| 8505804 | Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device | Toshinori Ogashiwa, Yoji Nagano | 2013-08-13 |
| 8492894 | Bump, method for forming the bump, and method for mounting substrate having the bump thereon | Toshinori Ogashiwa | 2013-07-23 |
| 7789287 | Method of bonding | Toshinori Ogashiwa | 2010-09-07 |
| 6174462 | Conductive paste composition including conductive metallic powder | Kengo Oka, Takashi Nagasaka, Yuji Ootani, Kazumasa Naito | 2001-01-16 |