Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12157170 | Conductive bonding material, bonding member including the conductive bonding material, and bonding method | Kazuo Ueda | 2024-12-03 |
| 12000019 | Gold powder, production method for gold powder, and gold paste | Masayuki Miyairi | 2024-06-04 |
| 11626334 | Through-hole sealing structure | Yuya Sasaki, Masayuki Miyairi | 2023-04-11 |
| 10870151 | Structure and method for sealing through-hole, and transfer substrate for sealing through-hole | Yuya Sasaki, Masayuki Miyairi, Kenichi Inoue | 2020-12-22 |
| 10366963 | Noble metal paste for bonding of semiconductor element | Masayuki Miyairi, Nobuyuki Akiyama, Katsuji Inagaki | 2019-07-30 |
| 10256113 | Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate | Masaaki Kurita, Takashi Nishimori, Yukio Kanehira | 2019-04-09 |
| 10125015 | Package production method and package produced by the method | Yuya Sasaki, Masayuki Miyairi | 2018-11-13 |
| 9561952 | Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member | Yuya Sasaki, Masayuki Miyairi | 2017-02-07 |
| 9539671 | Precious metal paste for bonding semiconductor element | Masayuki Miyairi, Nobuyuki Akiyama, Katsuji Inagaki | 2017-01-10 |
| 9065418 | Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same material | Masaaki Kurita, Takashi Terui, Takeyuki Sagae, Katsunori Akane, Kenzo Okamoto +2 more | 2015-06-23 |
| 8962471 | Bump, method for forming the bump, and method for mounting substrate having the bump thereon | Masayuki Miyairi | 2015-02-24 |
| 8912088 | Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate | Masaaki Kurita, Takashi Nishimori, Yukio Kanehira | 2014-12-16 |
| 8558433 | Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device | Masayuki Miyairi, Yoji Nagano | 2013-10-15 |
| 8505804 | Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device | Masayuki Miyairi, Yoji Nagano | 2013-08-13 |
| 8492894 | Bump, method for forming the bump, and method for mounting substrate having the bump thereon | Masayuki Miyairi | 2013-07-23 |
| 7789287 | Method of bonding | Masayuki Miyairi | 2010-09-07 |
| 6187114 | Solder material and electronic part using the same | Takatoshi Arikawa, Masami Yokozawa, Kazuhiro Aoi, Yoshiharu Sawada | 2001-02-13 |
| 6160224 | Solder material and electronic part using the same | Takatoshi Arikawa | 2000-12-12 |
| 5550407 | Semiconductor device having an aluminum alloy wiring line | — | 1996-08-27 |
| 5514334 | Fine lead alloy wire for forming bump electrodes | — | 1996-05-07 |
| 5514912 | Method for connecting semiconductor material and semiconductor device used in connecting method | — | 1996-05-07 |
| 5384090 | Fine wire for forming bump electrodes using a wire bonder | — | 1995-01-24 |
| 5366692 | Alloy connecting materials for semiconductors | — | 1994-11-22 |