Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6335223 | Method for producing a resin-sealed semiconductor device | Kouji Takada, Hiroyoshi Yoshida, Shigeki Sakaguchi | 2002-01-01 |
| 6215174 | Lead frame, mold for producing a resin-sealed semiconductor device, resin-sealed semiconductor device using such a lead frame | Kouji Takada, Hiroyoshi Yoshida, Shigeki Sakaguchi | 2001-04-10 |
| 6187114 | Solder material and electronic part using the same | Toshinori Ogashiwa, Takatoshi Arikawa, Kazuhiro Aoi, Yoshiharu Sawada | 2001-02-13 |
| 5629551 | Semiconductor device comprising an over-temperature detection element for detecting excessive temperatures amplifiers | Hideaki Nakura, Kazuhiko Tsubaki, Masasuke Yoshimura | 1997-05-13 |
| 5461252 | Semiconductor device comprising an over-temperature detection element for detecting excessive temperature of amplifiers | Hideaki Nakura, Kazuhiko Tsubaki, Masasuke Yoshimura | 1995-10-24 |
| 5298793 | Semiconductor device including an electrode | Jutaro Kotani, Masahiro Ihara, Hideaki Nakura | 1994-03-29 |
| 4589010 | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor | Kenichi Tateno, Hiroyuki Fujii, Mikio Nishikawa, Michio Katoh, Fujio Wada | 1986-05-13 |
| 4503452 | Plastic encapsulated semiconductor device and method for manufacturing the same | Isao KANAI | 1985-03-05 |
| 4482915 | Lead frame for plastic encapsulated semiconductor device | Mikio Nishikawa, Hiroyuki Fujii, Kenichi Tateno | 1984-11-13 |
| 4451973 | Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor | Kenichi Tateno, Hiroyuki Fujii, Mikio Nishikawa, Michio Katoh, Fujio Wada | 1984-06-05 |