Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362522 | Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device | Shuji Fukai, Yusuke Kubota, Mika Jikumaru, Takeshi Nishi, Akihisa Shimomura +1 more | 2016-06-07 |
| 8941017 | Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus | — | 2015-01-27 |
| 8895407 | Manufacturing method of SOI substrate and manufacturing method of semiconductor device | Hidekazu Miyairi, Akihisa Shimomura, Tatsuya Mizoi, Eiji Higa | 2014-11-25 |
| 8558433 | Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device | Toshinori Ogashiwa, Masayuki Miyairi | 2013-10-15 |
| 8505804 | Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device | Toshinori Ogashiwa, Masayuki Miyairi | 2013-08-13 |
| 8344599 | Quartz crystal device and method for sealing the same | Tatsuya Anzai, Hideo Tanaya | 2013-01-01 |
| 8193068 | Method of manufacturing SOI substrate | Shunpei Yamazaki, Eiji Higa, Tatsuya Mizoi, Akihisa Shimomura | 2012-06-05 |
| 8069549 | Method for sealing a quartz crystal device | Tatsuya Anzai, Hideo Tanaya | 2011-12-06 |
| 7928635 | Package for electronic component and piezoelectric resonator | Hideo Tanaya, Tatsuya Anzai | 2011-04-19 |
| 7897476 | Method of manufacturing SOI substrate | Shunpei Yamazaki, Eiji Higa, Tatsuya Mizoi, Akihisa Shimomura | 2011-03-01 |
| 7820524 | Manufacturing method of SOI substrate and manufacturing method of semiconductor device | Hidekazu Miyairi, Akihisa Shimomura, Tatsuya Mizoi, Eiji Higa | 2010-10-26 |
| 5304241 | Electronic component sealing filler | Takashi Ueno, Toshiaki Maeda | 1994-04-19 |
| 5298328 | Packing material and method of making same | Hajime Abe, Tsutomu Nishiwaki | 1994-03-29 |