Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5646827 | Electronic device having a plurality of circuit boards arranged therein | Yasunobu Hirao, Yuji Motoyama, Yukihiro Maeda | 1997-07-08 |
| 5627344 | Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate | Nozomi Tanifuji, Akihiko Naito, Koji Sawada, Tohru Nomura, Yoshiyuki Miyase | 1997-05-06 |
| 5593722 | Method of producing thick multi-layer substrates | Yuji Otani, Mitsuhiro Saitou | 1997-01-14 |
| 5586388 | Method for producing multi-board electronic device | Yasunobu Hirao, Yuji Motoyama, Hidekazu Katsuyama | 1996-12-24 |
| 5562973 | Ceramic multi-layer wiring board | Yuji Otani, Mitsuhiro Saitou | 1996-10-08 |
| 5506494 | Resistor circuit with reduced temperature coefficient of resistance | Hajime Ito | 1996-04-09 |
| 5500278 | Multilayer substrate | — | 1996-03-19 |
| 5483217 | Electronic circuit device | Mitsuhiro Saitou, Takahisa Koyasu, Hiroyuki Ban, Yuji Otani, Kengo Oka +1 more | 1996-01-09 |
| 5439732 | Ceramic multi-layer wiring board | Yuji Ontani, Mitsuhiro Saitou | 1995-08-08 |
| 5408383 | Container for electronic devices having a plurality of circuit boards | Yuji Motoyama, Yasunobu Hirao, Makoto Koyama, Mamoru Urushizaki, Hidekazu Katsuyama +1 more | 1995-04-18 |
| 5383093 | Hybrid integrated circuit apparatus | — | 1995-01-17 |
| 5308686 | Substrate having a multiple metal protected conductive layer and method of manufacturing the same | Hideki Nakagawara | 1994-05-03 |
| 5290375 | Process for manufacturing ceramic multilayer substrate | Hideki Nakagawara | 1994-03-01 |
| 5156903 | Multilayer ceramic substrate and manufacture thereof | Takamasa Okumura, Kohmei Kawaguchi, Masataka Aoki, Tohru Nomura, Yoshiyuki Miyase | 1992-10-20 |