Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9009948 | Method of manufacturing stator coil for electric rotating machine | Masaomi Dobashi, Hideji Shimaoka, Youichi Kamakura | 2015-04-21 |
| 8156804 | Capacitive semiconductor sensor | Minekazu Sakai, Michihiro Masuda | 2012-04-17 |
| 7971349 | Bump bonding method | Masaaki Tanaka | 2011-07-05 |
| 7659127 | Manufacturing device of semiconductor package and manufacturing method of semiconductor package | Michihiro Masuda, Takashige Saitoh | 2010-02-09 |
| 7579212 | Semiconductor device having tin-based solder layer and method for manufacturing the same | Akira Tanahashi, Chikage Noritake, Shoji Miura | 2009-08-25 |
| 7470996 | Packaging method | Takao Yoneyama, Nobuya Makino, Ryuichiro Abe | 2008-12-30 |
| 7420246 | Vertical type semiconductor device and method for manufacturing the same | Shoji Ozoe, Tomofusa Shiga, Yoshifumi Okabe, Takaaki Aoki, Takeshi Fukazawa | 2008-09-02 |
| 7361996 | Semiconductor device having tin-based solder layer and method for manufacturing the same | Akira Tanahashi, Chikage Noritake, Shoji Miura | 2008-04-22 |