| 9070666 |
Semiconductor device including cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado +2 more |
2015-06-30 |
| 8957517 |
Semiconductor device including cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado +2 more |
2015-02-17 |
| 8884426 |
Semiconductor device including cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado +2 more |
2014-11-11 |
| 8558375 |
Semiconductor package cooled by grounded cooler |
Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado +2 more |
2013-10-15 |
| 8530281 |
Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip |
Tsuyoshi Arai, Naoki Hiraiwa |
2013-09-10 |
| 7944045 |
Semiconductor module molded by resin with heat radiation plate opened outside from mold |
Takanori Teshima, Kuniaki Mamitsu |
2011-05-17 |
| 7601625 |
Method for manufacturing semiconductor device having solder layer |
Yoshitsugu Sakamoto, Akira Tanahashi, Hideki Okada, Tomomasa Yoshida |
2009-10-13 |
| 7579212 |
Semiconductor device having tin-based solder layer and method for manufacturing the same |
Kimiharu Kayukawa, Akira Tanahashi, Shoji Miura |
2009-08-25 |
| 7361996 |
Semiconductor device having tin-based solder layer and method for manufacturing the same |
Kimiharu Kayukawa, Akira Tanahashi, Shoji Miura |
2008-04-22 |
| 7148125 |
Method for manufacturing semiconductor power device |
Mikimasa Suzuki |
2006-12-12 |
| 6927167 |
Method for manufacturing semiconductor device having controlled surface roughness |
Yutaka Fukuda, Naohiko Hirano, Shoji Miura |
2005-08-09 |
| 5656858 |
Semiconductor device with bump structure |
Ichiharu Kondo, Yusuke Watanabe |
1997-08-12 |