Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079226 | Semiconductor device | Takanori Teshima | 2018-09-18 |
| 9070666 | Semiconductor device including cooler | Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake +2 more | 2015-06-30 |
| 8963315 | Semiconductor device with surface electrodes | Daisuke Fukuoka, Takanori Teshima | 2015-02-24 |
| 8957517 | Semiconductor device including cooler | Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake +2 more | 2015-02-17 |
| 8884426 | Semiconductor device including cooler | Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake +2 more | 2014-11-11 |
| 8558375 | Semiconductor package cooled by grounded cooler | Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake +2 more | 2013-10-15 |
| 8547697 | Fixing structure and fixing method of circuit board with embedded electronic parts to cooler | Keita FUKUTANI | 2013-10-01 |
| 8497572 | Semiconductor module and method of manufacturing the same | Keita FUKUTANI, Yasushi Ookura, Masayoshi Nishihata, Hiroyuki Wado, Syun Sugiura | 2013-07-30 |
| 8441122 | Semiconductor device having semiconductor chip and metal plate | Daisuke Fukuoka, Takanori Teshima, Ken Sakamoto, Tetsuo Fujii, Akira Tai +2 more | 2013-05-14 |
| 8278747 | Semiconductor apparatus having a two-side heat radiation structure | Tetsuo Fujii | 2012-10-02 |
| 8125781 | Semiconductor device | Takanori Teshima | 2012-02-28 |
| 7957135 | Semiconductor module | Yasuyuki Ohkouchi | 2011-06-07 |
| 7944045 | Semiconductor module molded by resin with heat radiation plate opened outside from mold | Chikage Noritake, Takanori Teshima | 2011-05-17 |
| 7728413 | Resin mold type semiconductor device | Tomoo Iwade | 2010-06-01 |
| 7573687 | Power semiconductor device | — | 2009-08-11 |
| 7470939 | Semiconductor device | Akira Mochida, Kenichi Oohama | 2008-12-30 |
| 7345369 | Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same | Naoki Hirasawa, Sadahisa Onimaru, Hirohito Matsui, Naohiko Hirano | 2008-03-18 |
| 7239016 | Semiconductor device having heat radiation plate and bonding member | Naohiko Hirano, Nobuyuki Kato, Yoshimi Nakase | 2007-07-03 |
| 7235876 | Semiconductor device having metallic plate with groove | Tomomi Okumura, Yoshitsugu Sakamoto, Naohiko Hirano | 2007-06-26 |
| 7145254 | Transfer-molded power device and method for manufacturing transfer-molded power device | Naohiko Hirano, Takanori Teshima, Yoshimi Nakase, Kenji Yagi, Yasushi Ookura +2 more | 2006-12-05 |
| 7091603 | Semiconductor device | Yoshimi Nakase | 2006-08-15 |
| 6992383 | Semiconductor device having radiation structure | Yasuyoshi Hirai | 2006-01-31 |
| 6967404 | Semiconductor device having radiation structure | Yasuyoshi Hirai | 2005-11-22 |
| 6960825 | Semiconductor device having radiation structure | Yasuyoshi Hirai | 2005-11-01 |
| 6891265 | Semiconductor device having radiation structure | Yasuyoshi Hirai | 2005-05-10 |