Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545419 | Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals | Takuya Kadoguchi, Takahiro HIRANO, Arata Harada, Tomomi Okumura, Masayoshi Nishihata | 2023-01-03 |
| 10103090 | Semiconductor device | Takuya Kadoguchi, Takahiro HIRANO, Takanori Kawashima, Tomomi Okumura, Masayoshi Nishihata | 2018-10-16 |
| 9711884 | Terminal connection structure and semiconductor apparatus | Takuya Kadoguchi, Arata Harada, Takahiro HIRANO, Masayoshi Nishihata, Tomomi Okumura | 2017-07-18 |
| 9224662 | Semiconductor apparatus | Takuya Kadoguchi, Takahiro HIRANO, Tomomi Okumura, Masayoshi Nishihata | 2015-12-29 |
| 8547697 | Fixing structure and fixing method of circuit board with embedded electronic parts to cooler | Kuniaki Mamitsu | 2013-10-01 |
| 8497572 | Semiconductor module and method of manufacturing the same | Kuniaki Mamitsu, Yasushi Ookura, Masayoshi Nishihata, Hiroyuki Wado, Syun Sugiura | 2013-07-30 |