Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315825 | Semiconductor device having wire pieces in bonding member | Daisuke Fukuoka, Yuuji Ootani, Wataru Kobayashi, Takumi Nomura, Tomoaki MITSUNAGA +3 more | 2025-05-27 |
| 11742256 | Semiconductor device | Masanori OOSHIMA, Takahiro HIRANO | 2023-08-29 |
| 11545419 | Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals | Takuya Kadoguchi, Takahiro HIRANO, Arata Harada, Keita FUKUTANI, Masayoshi Nishihata | 2023-01-03 |
| 10943859 | Semiconductor device | Eiji Hayashi, RYOJI UWATAKI | 2021-03-09 |
| 10304777 | Semiconductor device having a plurality of semiconductor modules connected by a connection component | Takashi Ueta | 2019-05-28 |
| 10283429 | Semiconductor device | Shingo Iwasaki | 2019-05-07 |
| 10157815 | Semiconductor device | Keita Hatasa, Makoto Imai | 2018-12-18 |
| 10103090 | Semiconductor device | Takuya Kadoguchi, Takahiro HIRANO, Takanori Kawashima, Keita FUKUTANI, Masayoshi Nishihata | 2018-10-16 |
| 10026673 | Semiconductor device and power module | — | 2018-07-17 |
| 9960096 | Semiconductor device | Takuya Kadoguchi | 2018-05-01 |
| 9831160 | Semiconductor device | Takuya Kadoguchi, Takahiro HIRANO, Takanori Kawashima, Masayoshi Nishihata | 2017-11-28 |
| 9711884 | Terminal connection structure and semiconductor apparatus | Takuya Kadoguchi, Arata Harada, Takahiro HIRANO, Masayoshi Nishihata, Keita FUKUTANI | 2017-07-18 |
| 9406593 | Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus | Takuya Kadoguchi, Takahiro HIRANO, Arata Harada, Masayoshi Nishihata | 2016-08-02 |
| 9331001 | Semiconductor module | Takuya Kadoguchi, Yoshikazu Suzuki, Masaya Kaji, Kiyofumi Nakajima, Tatsuya Miyoshi +1 more | 2016-05-03 |
| 9312211 | Semiconductor device and manufacturing method thereof | Takuya Kadoguchi, Shingo Iwasaki, Akira Mochida | 2016-04-12 |
| 9236330 | Power module | Takuya Kadoguchi, Takanori Kawashima | 2016-01-12 |
| 9224662 | Semiconductor apparatus | Takuya Kadoguchi, Takahiro HIRANO, Keita FUKUTANI, Masayoshi Nishihata | 2015-12-29 |
| 9059145 | Power module, method for manufacturing power module, and molding die | Takuya Kadoguchi, Yoshikazu Suzuki, Tatsuya Miyoshi, Takanori Kawashima | 2015-06-16 |
| 9006784 | Semiconductor device and manufacturing method thereof | Takuya Kadoguchi | 2015-04-14 |
| 8994167 | Semiconductor device | Takuya Kadoguchi, Shingo Iwasaki, Tomohiro Miyazaki, Masayoshi Nishihata | 2015-03-31 |
| 8884411 | Semiconductor device and manufacturing method thereof | Takuya Kadoguchi, Shingo Iwasaki, Takanori Kawashima, Masayoshi Nishihata | 2014-11-11 |
| 8810026 | Semiconductor module | Takuya Kadoguchi, Yoshikazu Suzuki, Masaya Kaji, Kiyofumi Nakajima, Tatsuya Miyoshi +1 more | 2014-08-19 |
| 8742556 | Semiconductor module | Takuya Kadoguchi, Tatsuya Miyoshi | 2014-06-03 |
| 7800230 | Solder preform and electronic component | Naohiko Hirano, Yoshitsugu Sakamoto, Kaichi Tsuruta, Minoru Ueshima, Takashi Ishii | 2010-09-21 |
| 7235876 | Semiconductor device having metallic plate with groove | Yoshitsugu Sakamoto, Naohiko Hirano, Kuniaki Mamitsu | 2007-06-26 |