Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7470996 | Packaging method | Takao Yoneyama, Kimiharu Kayukawa, Ryuichiro Abe | 2008-12-30 |
| 7405478 | Substrate package structure and packaging method thereof | Katsumi Ishikawa, Hiroshi Takei, Tetsuro Yano | 2008-07-29 |
| 7285854 | Wire bonding method and semiconductor device | Katsumi Ishikawa, Hiroshi Takei | 2007-10-23 |