Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Hiroki Sudo, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma +4 more | 2022-05-31 |
| 10265808 | Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solder | Motohiro Onitsuka, Yoko Kurasawa, Toshihisa Kugi, Kaichi Tsuruta | 2019-04-23 |