Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412487 | Secret calculation system, apparatus, method and program | Ryo Kikuchi, Dai Ikarashi | 2025-09-09 |
| 12386948 | Secure computation apparatus, secure computation system, secure computation method, and program | Dai Ikarashi | 2025-08-12 |
| 12109653 | Solder alloy, solder ball, solder paste, and solder joint | Takahiro Matsufuji, Shunsaku Yoshikawa | 2024-10-08 |
| 12095906 | Secret survival data processing system, secret survival data processing apparatus, secret survival data processing method, and program | Atsunori ICHIKAWA, Dai Ikarashi, Koki Hamada, Ryo Kikuchi, Ibuki MISHINA | 2024-09-17 |
| 11872656 | Core material, electronic component and method for forming bump electrode | Shigeki Kondoh, Masato Tsuchiya, Hiroshi Okada, Daisuke Souma | 2024-01-16 |
| 11478869 | Method for forming bump electrode substrate | Takahiro Hattori, Hiroshi Okada, Daisuke Souma | 2022-10-25 |
| 11344976 | Solder material, solder paste, and solder joint | Hiroyoshi Kawasaki, Takahiro Roppongi, Hiroshi Okada, Daisuke Soma, Takashi Akagawa +4 more | 2022-05-31 |
| 10888959 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2021-01-12 |
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2020-05-05 |
| 10610979 | Flux composition for solder applications | Daisuke Maruko, Atsumi Takahashi, Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi +4 more | 2020-04-07 |