Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12377500 | Lead-free and antimony-free solder alloy, solder ball, and solder joint | Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei | 2025-08-05 |
| 12109653 | Solder alloy, solder ball, solder paste, and solder joint | Shunsaku Yoshikawa, Hiroki Sudo | 2024-10-08 |
| 12053843 | Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device | Shunsaku Yoshikawa, Takashi Saito, Yuuki Iijima, Kanta Dei | 2024-08-06 |
| 11607753 | Solder alloy, cast article, formed article, and solder joint | Shunsaku Yoshikawa, Takashi Saito, Naoko IZUMITA, Yuuki Iijima, Kanta Dei | 2023-03-21 |
| 11241760 | Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint | Takahiro Yokoyama, Hikaru Nomura, Shunsaku Yoshikawa | 2022-02-08 |