Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12383987 | Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint | Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito | 2025-08-12 |
| 12377500 | Lead-free and antimony-free solder alloy, solder ball, and solder joint | Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Takahiro Matsufuji | 2025-08-05 |
| 12080671 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Masato Tsuchiya | 2024-09-03 |
| 12053843 | Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device | Shunsaku Yoshikawa, Takashi Saito, Yuuki Iijima, Takahiro Matsufuji | 2024-08-06 |
| 11633815 | Solder paste | Toru Hayashida, Shunsaku Yoshikawa, Takashi Saito | 2023-04-25 |
| 11607753 | Solder alloy, cast article, formed article, and solder joint | Shunsaku Yoshikawa, Takashi Saito, Takahiro Matsufuji, Naoko IZUMITA, Yuuki Iijima | 2023-03-21 |