Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12179291 | Method for step-soldering | Takashi Saito, Shunsaku Yoshikawa | 2024-12-31 |
| 11607753 | Solder alloy, cast article, formed article, and solder joint | Shunsaku Yoshikawa, Takashi Saito, Takahiro Matsufuji, Yuuki Iijima, Kanta Dei | 2023-03-21 |
| 11167379 | Solder alloy, solder ball, solder preform, solder paste and solder joint | Yuki Iijima, Hikaru Nomura, Takashi Saito, Shunsaku Yoshikawa | 2021-11-09 |
| 10967464 | Solder alloy, solder paste, and solder joint | Shunsaku Yoshikawa, Yoshie Tachibana | 2021-04-06 |
| 10500680 | Solder alloy, solder ball, and solder joint | Ken Tachibana, Hikaru Nomura, Yuki Iijima, Takashi Saito, Takahiro Yokoyama +1 more | 2019-12-10 |
| 10343238 | Lead-free solder alloy | Masayuki Suzuki, Shunsaku Yoshikawa, Ken Tachibana, Rei Fujimaki, Hikaru Nomura | 2019-07-09 |