HN

Hikaru Nomura

SC Senju Metal Industry Co.: 8 patents #29 of 349Top 9%
AU Akita University: 1 patents #21 of 60Top 35%
OU Osaka University: 1 patents #681 of 1,984Top 35%
Canon: 1 patents #14,899 of 19,416Top 80%
📍 Suita, JP: #168 of 1,253 inventorsTop 15%
Overall (All Time): #497,963 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
11241760 Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint Takahiro Yokoyama, Takahiro Matsufuji, Shunsaku Yoshikawa 2022-02-08
11167379 Solder alloy, solder ball, solder preform, solder paste and solder joint Yuki Iijima, Takashi Saito, Naoko IZUMITA, Shunsaku Yoshikawa 2021-11-09
10500680 Solder alloy, solder ball, and solder joint Ken Tachibana, Yuki Iijima, Takashi Saito, Takahiro Yokoyama, Shunsaku Yoshikawa +1 more 2019-12-10
10343238 Lead-free solder alloy Masayuki Suzuki, Naoko IZUMITA, Shunsaku Yoshikawa, Ken Tachibana, Rei Fujimaki 2019-07-09
10213879 Solder alloy Shunsaku Yoshikawa 2019-02-26
10076808 Lead-free solder alloy Tsukasa Ohnishi, Shunsaku Yoshikawa, Ken Tachibana, Yoshie Yamanaka, Kyu Oh Lee 2018-09-18
9907155 Printed wiring board and printed circuit board Takashi Numagi, Masanori Kikuchi, Hiroyuki Mizuno 2018-02-27
9808890 Solder alloy Shunsaku Yoshikawa 2017-11-07
9780055 Lead-free solder ball Yoshie Yamanaka, Ken Tachibana, Shunsaku Yoshikawa 2017-10-03
9482692 Magnetic field value measuring device and method for measuring magnetic field value Hitoshi Saito, Satoru Yoshimura, Yukinori Kinoshita, Ryoichi Nakatani 2016-11-01