Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12290884 | Solder paste and solder joint | Shinji Kikuchi, Tomoki Sasaki, Ayumi Mio | 2025-05-06 |
| 12017306 | Solder paste | Takeshi Sakamoto, Shunsuke KOGA | 2024-06-25 |
| 11911854 | Solder alloy, solder paste, solder preform and solder joint | Takeshi Sakamoto | 2024-02-27 |
| 11904416 | Solder alloy, solder powder, solder paste and solder joint | Tomoki Sasaki, Norikazu Sakai, Yoshihiro Yamaguchi | 2024-02-20 |
| 11858071 | Solder alloy, solder paste, solder ball, solder preform, and solder joint | Ryuki Horie | 2024-01-02 |
| 11772204 | Preform solder and method of manufacturing the same, and method of manufacturing solder joint | Shunsuke KOGA, Tomoki Sasaki, Shunsaku Yoshikawa | 2023-10-03 |
| 11628520 | Preform solder and method of manufacturing the same, and method of manufacturing solder joint | Shunsuke KOGA, Tomoki Sasaki, Shunsaku Yoshikawa | 2023-04-18 |
| 11278955 | Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor | Jinting Jiu | 2022-03-22 |
| 10968932 | Soldered joint and method for forming soldered joint | Minoru Ueshima | 2021-04-06 |
| 10967464 | Solder alloy, solder paste, and solder joint | Naoko IZUMITA, Shunsaku Yoshikawa | 2021-04-06 |
| 10658107 | Method of manufacturing permanent magnet | Daisuke SAKUMA, Kazuaki Haga, Takaaki Takahashi, Minoru Ueshima, Takashi Akagawa | 2020-05-19 |
| 9837757 | Lead-free solder alloy and in-vehicle electronic circuit | Shunsaku Yoshikawa, Naoko Hirai, Ken Tachibana | 2017-12-05 |