Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12257622 | Joining material, production method for joining material, and joined body | — | 2025-03-25 |
| 12119131 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Minoru Ueshima, Katsuaki Suganuma, Wanli Li | 2024-10-15 |
| 11710580 | Electrically conductive paste and sintered body | Tetsu Takemasa, Junko Seino | 2023-07-25 |
| 11278955 | Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor | Yoshie Tachibana | 2022-03-22 |
| 11217359 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Minoru Ueshima, Katsuaki Suganuma, Wanli Li | 2022-01-04 |
| 10875097 | Silver particle producing method, silver particles, and silver paste | Katsuaki Suganuma | 2020-12-29 |
| 10651143 | Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure | Tomotoshi Satoh, Hiroya Sato, Katsuaki Suganuma, Aiji Suetake, Shijo Nagao +1 more | 2020-05-12 |
| 10625344 | Method for producing copper particles, copper particles, and copper paste | Katsuaki Suganuma | 2020-04-21 |
| 10201852 | Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste | Katsuaki Suganuma | 2019-02-12 |
| 10099291 | Method for producing metal nanowires and silver nanowires | Katsuaki Suganuma, Masaya Nogi, Tohru Sugahara, Teppei ARAKI, Hiroshi Uchida +3 more | 2018-10-16 |