Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454601 | Substrate evaluation chip and substrate evaluation device | Katsuaki Suganuma, Akio Shimoyama, Dongjin Kim, Kazutaka Takeshita, Naoki Wakasugi | 2022-09-27 |
| 11273525 | Bonding material, method for producing bonding material, and method for producing bonding structure | Katsuaki Suganuma, Shih-Kang Lin | 2022-03-15 |
| 11049840 | Bonding device | Katsuaki Suganuma, Akio Shimoyama, Shinya Seki | 2021-06-29 |
| 10651143 | Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure | Tomotoshi Satoh, Hiroya Sato, Katsuaki Suganuma, Aiji Suetake, Jinting Jiu +1 more | 2020-05-12 |
| 10332853 | Bonding structure and method for producing bonding structure | Katsuaki Suganuma, Chulmin Oh | 2019-06-25 |