Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454601 | Substrate evaluation chip and substrate evaluation device | Katsuaki Suganuma, Shijo Nagao, Dongjin Kim, Kazutaka Takeshita, Naoki Wakasugi | 2022-09-27 |
| 11049840 | Bonding device | Katsuaki Suganuma, Shijo Nagao, Shinya Seki | 2021-06-29 |
| 7605057 | Semiconductor device and manufacturing method thereof | Hajime Oda, Keiichi Sawai, Takayuki Taniguchi | 2009-10-20 |
| 7364664 | Foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method | Kazushi Kodama | 2008-04-29 |
| 5197650 | Die bonding apparatus | Masahiko Monzen, Noriki Iwasaki | 1993-03-30 |
| 5173147 | Apparatus for sealing a semiconductor package having frosted quartz glass piece and UV light source | Kouki Kitaoka, Noriki Iwasaki | 1992-12-22 |