Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6984586 | Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers | Satoru Fukunaga, Tadayuki Into | 2006-01-10 |
| 6582223 | Pickup apparatus for semiconductor chips | Hiroshi Yasumura, Tadayuki Into, Yasuhiro Goto, Tatsuyuki Ishioka | 2003-06-24 |
| 6520844 | Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers | Satoru Fukunaga, Tadayuki Into | 2003-02-18 |
| 5197650 | Die bonding apparatus | Masahiko Monzen, Akio Shimoyama | 1993-03-30 |
| 5173147 | Apparatus for sealing a semiconductor package having frosted quartz glass piece and UV light source | Akio Shimoyama, Kouki Kitaoka | 1992-12-22 |