Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6984586 | Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers | Noriki Iwasaki, Satoru Fukunaga | 2006-01-10 |
| 6582223 | Pickup apparatus for semiconductor chips | Hiroshi Yasumura, Noriki Iwasaki, Yasuhiro Goto, Tatsuyuki Ishioka | 2003-06-24 |
| 6520844 | Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers | Noriki Iwasaki, Satoru Fukunaga | 2003-02-18 |