Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6984586 | Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers | Noriki Iwasaki, Tadayuki Into | 2006-01-10 |
| 6520844 | Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers | Noriki Iwasaki, Tadayuki Into | 2003-02-18 |
| 6423102 | Jig used for assembling semiconductor devices | Hiroyuki Nakanishi | 2002-07-23 |
| 5412314 | Testing apparatus for semiconductor device formed on tape carrier | Junichirou Hisatomi, Kazuhiro Nakamura, Ken'ichi Ohi, Hideki Tanaka, Masayuki Tabuchi | 1995-05-02 |
| 5247248 | Burn-in apparatus and method of use thereof | — | 1993-09-21 |