KS

Katsuaki Suganuma

OU Osaka University: 19 patents #7 of 1,984Top 1%
Nichia: 6 patents #327 of 1,531Top 25%
SC Senju Metal Industry Co.: 3 patents #91 of 349Top 30%
NL Nippon Sheet Glass Company, Limited: 2 patents #332 of 836Top 40%
SK Showa Denko K.K.: 2 patents #639 of 1,736Top 40%
DC Dowa Mining Co.: 2 patents #92 of 324Top 30%
Sharp Kabushiki Kaisha: 1 patents #6,861 of 10,731Top 65%
SH Shimadzu: 1 patents #1,152 of 2,007Top 60%
CC C.Uyemura & Co.: 1 patents #85 of 180Top 50%
YC Yamato Scientific Co.: 1 patents #11 of 40Top 30%
DA Daicel: 1 patents #265 of 523Top 55%
NU National Cheng Kung University: 1 patents #348 of 1,128Top 35%
NM Nippon Mektron: 1 patents #123 of 286Top 45%
NO Nof: 1 patents #246 of 561Top 45%
OO Osaka Industrial Promotion Organization: 1 patents #5 of 33Top 20%
📍 Suita, JP: #24 of 1,253 inventorsTop 2%
Overall (All Time): #110,676 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 1–25 of 32 patents

Patent #TitleCo-InventorsDate
12318838 Dispersion medium for metal particle sintering, and electroconductive paste Takanori KOBATAKE, Shuhei Takata 2025-06-03
12134146 Bonding member, method for producing bonding member and method for producing bonding structure Chuantong CHEN, Toshiyuki ISHINA, Seungjun NOH, Chanyang CHOE 2024-11-05
12119131 Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part Jinting Jiu, Minoru Ueshima, Wanli Li 2024-10-15
12094850 Bonding structure production method and bonding structure Chuantong CHEN, Zheng Zhang 2024-09-17
11652197 Method for producing an electronic device Masafumi Kuramoto, Satoru Ogawa, Keun Soo Kim 2023-05-16
11454601 Substrate evaluation chip and substrate evaluation device Shijo Nagao, Akio Shimoyama, Dongjin Kim, Kazutaka Takeshita, Naoki Wakasugi 2022-09-27
11331759 Solder alloy for power devices and solder joint having a high current density Hans-Jurgen Albrecht, Klaus Wilke, Minoru Ueshima 2022-05-17
11273525 Bonding material, method for producing bonding material, and method for producing bonding structure Shijo Nagao, Shih-Kang Lin 2022-03-15
11217359 Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part Jinting Jiu, Minoru Ueshima, Wanli Li 2022-01-04
11049840 Bonding device Shijo Nagao, Akio Shimoyama, Shinya Seki 2021-06-29
10950770 Method for producing an electronic device Masafumi Kuramoto, Satoru Ogawa, Keun Soo Kim 2021-03-16
10875097 Silver particle producing method, silver particles, and silver paste Jinting Jiu 2020-12-29
10651143 Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure Tomotoshi Satoh, Hiroya Sato, Aiji Suetake, Shijo Nagao, Jinting Jiu +1 more 2020-05-12
10625344 Method for producing copper particles, copper particles, and copper paste Jinting Jiu 2020-04-21
10573795 Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device Masafumi Kuramoto, Satoru Ogawa, Keun Soo Kim 2020-02-25
10332853 Bonding structure and method for producing bonding structure Shijo Nagao, Chulmin Oh 2019-06-25
10201852 Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste Jinting Jiu 2019-02-12
10099291 Method for producing metal nanowires and silver nanowires Jinting Jiu, Masaya Nogi, Tohru Sugahara, Teppei ARAKI, Hiroshi Uchida +3 more 2018-10-16
9812624 Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device Masafumi Kuramoto, Satoru Ogawa, Keun Soo Kim 2017-11-07
9620286 Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet Masaya Nogi, Hirotaka Koga, Natsuki Komoda, Hirofumi Matsumoto, Masayuki Iwase +2 more 2017-04-11
9236162 Transparent conductive ink and transparent conductive pattern forming method Kuniaki Ohtsuka, Koichiro Murahashi, Yasutaka Takemura, Hiroshi Uchida 2016-01-12
9217192 Semiconductor device and bonding material for semiconductor device Seongjun KIM 2015-12-22
9157004 Composition for forming copper pattern and method for forming copper pattern Eui-chul Kang, Tomoyuki Ohtake, Masaya Nogi, Natsuki Komoda 2015-10-13
9011728 Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device Masafumi Kuramoto, Satoru Ogawa, Miki Niwa, Keun Soo Kim 2015-04-21
8968608 Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device Masafumi Kuramoto, Satoru Ogawa, Keun Soo Kim 2015-03-03