SN

Seungjun NOH

OU Osaka University: 1 patents #681 of 1,984Top 35%
📍 Suita, JP: #751 of 1,253 inventorsTop 60%
Overall (All Time): #2,542,962 of 4,157,543Top 65%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12134146 Bonding member, method for producing bonding member and method for producing bonding structure Katsuaki Suganuma, Chuantong CHEN, Toshiyuki ISHINA, Chanyang CHOE 2024-11-05