KS

Katsuaki Suganuma

OU Osaka University: 19 patents #7 of 1,984Top 1%
Nichia: 6 patents #327 of 1,531Top 25%
SC Senju Metal Industry Co.: 3 patents #91 of 349Top 30%
NL Nippon Sheet Glass Company, Limited: 2 patents #332 of 836Top 40%
SK Showa Denko K.K.: 2 patents #639 of 1,736Top 40%
DC Dowa Mining Co.: 2 patents #92 of 324Top 30%
Sharp Kabushiki Kaisha: 1 patents #6,861 of 10,731Top 65%
SH Shimadzu: 1 patents #1,152 of 2,007Top 60%
CC C.Uyemura & Co.: 1 patents #85 of 180Top 50%
YC Yamato Scientific Co.: 1 patents #11 of 40Top 30%
DA Daicel: 1 patents #265 of 523Top 55%
NU National Cheng Kung University: 1 patents #348 of 1,128Top 35%
NM Nippon Mektron: 1 patents #123 of 286Top 45%
NO Nof: 1 patents #246 of 561Top 45%
OO Osaka Industrial Promotion Organization: 1 patents #5 of 33Top 20%
📍 Suita, JP: #24 of 1,253 inventorsTop 2%
Overall (All Time): #110,676 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 26–32 of 32 patents

Patent #TitleCo-InventorsDate
8821708 Method of surface treatment for the inhibition of whiskers Masanobu Tsujimoto, Isamu Yanada, Keunsoo Kim 2014-09-02
7683195 Silver β-ketocarboxylate, material comprising the same for forming silver metal, and use thereof Shunro Yamaguchi, Mariko Hatamura 2010-03-23
6793990 Method of manufacturing glass panel and glasspanel manufactured by the method Koichi Sakaguchi, Shinjiro Domi, Shigeki Nakagaki 2004-09-21
6319461 Lead-free solder alloy Shinjiro Domi, Koichi Sakaguchi, Shigeki Nakagaki 2001-11-20
6183875 Electronic circuit substrates fabricated from an aluminum ceramic composite material Xiao NING, Choju Nagata, Masami Sakuraba, Toshikazu Tanaka, Masami Kimura 2001-02-06
5965193 Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material Xiao NING, Choju Nagata, Masami Sakuraba, Toshikazu Tanaka, Masami Kimura 1999-10-12
5024902 Fiber-reinforced metal Hiroyuki Fujii, Hiroyoshi Minakuchi, Katsuhiko Kada, Haruo Osafune, Kuniaki KANAMARU 1991-06-18