Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461188 | Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell device | Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Wataru Fujimori | 2016-10-04 |
| 8852465 | Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell device | Masashi Nakayama, Nobuo Ochiai, Takashi Hinotsu, Yutaka Nakayama, Wataru Fujimori | 2014-10-07 |
| 6399019 | Brazing material for use in joining a metal plate to a ceramic substrate | Masami Kimura, Masaya Takahara, Junji Nakamura | 2002-06-04 |
| 6354484 | Process for producing a metal-ceramic composite substrate | Masami Kimura, Masaya Takahara, Junji Nakamura | 2002-03-12 |
| 6221511 | Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method | Masami Kimura, Masaya Takahara, Junji Nakamura | 2001-04-24 |
| 6183875 | Electronic circuit substrates fabricated from an aluminum ceramic composite material | Xiao NING, Choju Nagata, Toshikazu Tanaka, Katsuaki Suganuma, Masami Kimura | 2001-02-06 |
| 6071592 | Metal-ceramic composite substrate | Masami Kimura, Junji Nakamura, Masaya Takahara | 2000-06-06 |
| 6054762 | Semiconductor substrates of high reliability ceramic metal composites | Masami Kimura, Junji Nakamura, Masaya Takahara | 2000-04-25 |
| 6013357 | Power module circuit board and a process for the manufacture thereof | Masami Kimura, Junji Nakamura, Masaya Takahara | 2000-01-11 |
| 5965193 | Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material | Xiao NING, Choju Nagata, Toshikazu Tanaka, Katsuaki Suganuma, Masami Kimura | 1999-10-12 |
| 5955686 | Brazing materials for producing metal-ceramics composite substrates | Masami Kimura, Junji Nakamura, Takashi Ono | 1999-09-21 |
| 5035837 | Copper paste composition | Shuji Saeki, Masatoshi Suehiro, Masashi Echigo, Susumu Okada | 1991-07-30 |
| 4937016 | Copper conductor composition | Masatoshi Suehiro, Masashi Echigo, Nobutoshi Kawamura | 1990-06-26 |
| 4906404 | Copper conductor composition | Masatoshi Suehiro, Masashi Echigo, Yutaka Mitsune, Seiichi Nakatani, Tsutomu Nishimura | 1990-03-06 |
| 4865772 | Copper thick film conductor composition | Masatoshi Suehiro, Masashi Echigo, Yutaka Mitsune, Seiichi Nakatani, Tsutomu Nishimura | 1989-09-12 |