Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6080336 | Via-filling conductive paste composition | Nobuaki Morishima | 2000-06-27 |
| 5977490 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Kouichi Iwaisako, Hideo Akiyama | 1999-11-02 |
| 5914358 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Kouichi Iwaisako, Hideo Akiyama | 1999-06-22 |
| 5733467 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Kouichi Iwaisako, Hideo Akiyama | 1998-03-31 |
| 5652042 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Kouichi Iwaisako, Hideo Akiyama | 1997-07-29 |
| 5035837 | Copper paste composition | Shuji Saeki, Masashi Echigo, Susumu Okada, Masami Sakuraba | 1991-07-30 |
| 4937016 | Copper conductor composition | Masashi Echigo, Masami Sakuraba, Nobutoshi Kawamura | 1990-06-26 |
| 4906404 | Copper conductor composition | Masashi Echigo, Masami Sakuraba, Yutaka Mitsune, Seiichi Nakatani, Tsutomu Nishimura | 1990-03-06 |
| 4865772 | Copper thick film conductor composition | Masashi Echigo, Yutaka Mitsune, Masami Sakuraba, Seiichi Nakatani, Tsutomu Nishimura | 1989-09-12 |