Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12291234 | Path planning device, path planning method, computer program product | — | 2025-05-06 |
| 12252128 | Trajectory generation device, trajectory generation method, and computer program product | Keigo Fujimoto | 2025-03-18 |
| 11345369 | Vehicle control method and system | Minoru Okada | 2022-05-31 |
| 6822534 | Laminated electronic component, laminated duplexer and communication device | Kazuhide Uriu, Hiroyuki Nakamura, Toru Yamada, Tsutomu Matsumura, Hiroshi Kagata +1 more | 2004-11-23 |
| 6326694 | Printed circuit board | Akihito Hatakeyama, Seiichi Nakatani, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 2001-12-04 |
| 6227051 | Acceleration sensor | Tetsuro Otsuchi, Katsu Takeda, Katsunori Moritoki, Osamu Kawasaki, Junichi Kato +1 more | 2001-05-08 |
| 6222302 | Piezoelectric actuator, infrared sensor and piezoelectric light deflector | Katsumi Imada, Katsunori Moritoki, Takeshi Masutani, Kouji Nomura | 2001-04-24 |
| 6211487 | Printed circuit board and method of manufacturing the same | Akihito Hatakeyama, Seiichi Nakatani, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 2001-04-03 |
| 6154356 | Laminated ceramic device | Hiroshi Kagata, Tatsuya Inoue, Hiroshi Sogou | 2000-11-28 |
| 6108903 | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same | Seiichi Nakatani, Akihito Hatakeyama, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 2000-08-29 |
| 6096411 | Conductive paste composition for via hole filling and printed circuit board using the same | Seiichi Nakatani, Tatsuo Ogawa | 2000-08-01 |
| 6050144 | Acceleration sensor | Tetsuro Otsuchi, Katsu Takeda, Katsunori Moritoki, Osamu Kawasaki, Junichi Kato +1 more | 2000-04-18 |
| 5977490 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1999-11-02 |
| 5972482 | Printed circuit board and method of manufacturing the same | Akihito Hatakeyama, Seiichi Nakatani, Hiroshi Sogou, Tatsuo Ogawa, Tamao Kojima | 1999-10-26 |
| 5960538 | Printed circuit board | Seiichi Nakatani, Masahide Tsukamoto | 1999-10-05 |
| 5914358 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1999-06-22 |
| 5817404 | Printed circuit board | Seiichi Nakatani, Masahide Tsukamoto | 1998-10-06 |
| 5733467 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1998-03-31 |
| 5652042 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste | Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Kouichi Iwaisako, Hideo Akiyama | 1997-07-29 |
| 5588207 | Method of manufacturing two-sided and multi-layered printed circuit boards | Masahide Tsukamoto, Yasukiho Horio, Seiichi Nakatani, Akihito Hatakeyama | 1996-12-31 |
| 5484647 | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same | Seiichi Nakatani, Akihito Hatakeyama, Hirishi Sogou, Tatsuo Ogawa, Tamao Kojima | 1996-01-16 |
| 5440075 | Two-sided printed circuit board a multi-layered printed circuit board | Masahide Tsukamoto, Yasuhiko Horio, Seiichi Nakatani, Akihito Hatakeyama | 1995-08-08 |
| 5093757 | Dielectric ceramic composition | Suzushi Kimura, Hideyuki Okinaka, Youichiro Yokotani, Mariko Ishikawa | 1992-03-03 |
| 5006956 | Dielectric ceramic composition | Suzushi Kimura, Hideyuki Orinaka, Youichiro Yokotani, Mariko Ishikawa | 1991-04-09 |