Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6850751 | Non-reciprocal circuit device, method of manufacturing, and mobile communication apparatus using the same | Kengo Shiiba, Munenori Fujimura, Hitoshi Uchi, Shuichiro Yamaguchi, Takayuki Takeuchi +2 more | 2005-02-01 |
| 6535074 | Non-reciprocal circuit element, lumped element type isolator, and mobile communication unit | Takayuki Takeuchi, Masumi Hattori, Hiroyuki Hase | 2003-03-18 |
| 6531930 | Non-reciprocal circuit element having a grounding land between input/output patterns | Takayuki Takeuchi, Masumi Hattori, Hiroyuki Hase | 2003-03-11 |
| 6396361 | Non-reciprocal circuit element with ground terminals on one side free of input/output terminals | Takayuki Takeuchi, Masumi Hattori, Hiroyuki Hase | 2002-05-28 |
| 5521454 | Surface wave filter element | Masumi Hattori, Hideo Torii, Masaki Aoki, Eiji Fujii, Atsushi Tomozawa +2 more | 1996-05-28 |
| 5481795 | Method of manufacturing organic substrate used for printed circuits | Akihito Hatakeyama, Hiroshi Sogo, Tamao Kojima, Masahide Tsukamoto, Yasushi Fukumura | 1996-01-09 |
| 5440075 | Two-sided printed circuit board a multi-layered printed circuit board | Kouji Kawakita, Masahide Tsukamoto, Seiichi Nakatani, Akihito Hatakeyama | 1995-08-08 |
| 5346750 | Porous substrate and conductive ink filled vias for printed circuits | Akihito Hatakeyama, Hiroshi Sogo, Tamao Kojima, Masahide Tsukamoto, Yasushi Fukumura | 1994-09-13 |
| 5090119 | Method of forming an electrical contact bump | Toshio Tsuda, Yoshihiro Bessho, Toru Ishida | 1992-02-25 |
| 5014111 | Electrical contact bump and a package provided with the same | Toshio Tsuda, Yoshihiro Bessho, Toru Ishida | 1991-05-07 |
| 4732798 | Multilayer ceramic substrate and method of making the same | Toru Ishida, Yasuharu Kikuchi, Tatsurou Kikuchi | 1988-03-22 |