Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5977490 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Hideo Akiyama | 1999-11-02 |
| 5914358 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Hideo Akiyama | 1999-06-22 |
| 5733467 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Hideo Akiyama | 1998-03-31 |
| 5652042 | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste | Kouji Kawakita, Seiichi Nakatani, Tatsuo Ogawa, Masatoshi Suehiro, Hideo Akiyama | 1997-07-29 |