Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5484647 | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same | Seiichi Nakatani, Akihito Hatakeyama, Kouji Kawakita, Tatsuo Ogawa, Tamao Kojima | 1996-01-16 |