CO

Chulmin Oh

OU Osaka University: 1 patents #681 of 1,984Top 35%
📍 Suita, JP: #751 of 1,253 inventorsTop 60%
Overall (All Time): #2,865,062 of 4,157,543Top 70%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10332853 Bonding structure and method for producing bonding structure Katsuaki Suganuma, Shijo Nagao 2019-06-25