Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089340 | Electronic component mounting device for mounting electronic components at certain intervals | Hiroshi Aoyama | 2024-09-10 |
| 11670526 | Electronic component mounting device for mounting electronic components | Hiroshi Aoyama | 2023-06-06 |
| 11633815 | Solder paste | Shunsaku Yoshikawa, Takashi Saito, Kanta Dei | 2023-04-25 |
| 11167380 | Flux for solder paste and solder paste | Rina Horikoshi | 2021-11-09 |
| 9844837 | Lead-free solder alloy | Masato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka +4 more | 2017-12-19 |