Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10722965 | Solder ball supplying method, solder ball supplying device, and solder bump forming method | Kaichi Tsuruta, Takeo Saito, Hiroki Oshima | 2020-07-28 |
| 10391589 | Flux applying device | Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara +3 more | 2019-08-27 |
| 10137538 | Liquid coating device | Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara +3 more | 2018-11-27 |
| 10111342 | Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet | Kaichi Tsuruta, Takeo Saitoh, Hiroki Oshima, Koji Yamashita, Shinichiro Kawahara | 2018-10-23 |