Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12420303 | Dual slot die coater and method for coating electrode active material slurry using the same | Taek Soo Lee, Young Gon Kim, Shin Wook Jeon, Sang Hoon Choy | 2025-09-23 |
| 12397316 | Multi-slot die coater | Taek Soo Lee, Shin Wook Jeon, Sang Hoon Choy | 2025-08-26 |
| 12134107 | Multi-slot die coater | Taek Soo Lee, Shin Wook Jeon, Sang Hoon Choy | 2024-11-05 |
| 11840496 | Method of preparing L-homoserine | Jung-Min Lee, Min-sup Kim, Il Chul Kim, In Sung Lee, Jun Young Jung | 2023-12-12 |
| 11798715 | Mn—Bi—Sb-based magnetic substance and method of manufacturing the same | Tae Gyu Lee, Jin Hyeok Cha, Jong Ryoul Kim | 2023-10-24 |
| 11270923 | Semiconductor packages including a heat insulation wall | Jae Hyun Son, Ji Hyeok Shin | 2022-03-08 |
| 11072621 | Methionine-metal chelate and manufacturing method thereof | Jun Woo Kim, Gyeonghwan Kim, Il Chul Kim, Juun Park, Yong Bum Seo +3 more | 2021-07-27 |
| 10998294 | Semiconductor packages having stacked chip structure | — | 2021-05-04 |
| 10981937 | Methionine-metal chelate and manufacturing method thereof | Jun Woo Kim, Gyeonghwan Kim, Il Chul Kim, Juun Park, Yong Bum Seo +3 more | 2021-04-20 |
| 10804209 | Semiconductor packages including a supporting block supporting an upper chip stack | — | 2020-10-13 |
| 10600713 | Semiconductor packages including a heat insulation wall | Jae Hyun Son, Ji Hyeok Shin | 2020-03-24 |
| 10393646 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Dong-Kil Shin, Chul Keun Yoon, Gyu Jei LEE | 2019-08-27 |
| 9945772 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Dong-Kil Shin, Chul Keun Yoon, Gyu Jei LEE | 2018-04-17 |
| 9227258 | Lead-free solder alloy having reduced shrinkage cavities | Yuji Kawamata, Minoru Ueshima, Kayako Nakagawa, Yasuaki Kokubu | 2016-01-05 |
| 7259070 | Semiconductor devices and methods for fabricating the same | Won RYU | 2007-08-21 |
| 6855993 | Semiconductor devices and methods for fabricating the same | Won RYU | 2005-02-15 |