Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569216 | Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor package | Wan Choon PARK, Jong Hoon Kim, Tae Hun Yi | 2023-01-31 |
| 10393646 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Dong-Kil Shin, Chul Keun Yoon, Min-Kyu Kang | 2019-08-27 |
| 9945772 | Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same | Dong-Kil Shin, Chul Keun Yoon, Min-Kyu Kang | 2018-04-17 |
| 8878349 | Semiconductor chip and stacked semiconductor package having the same | Kang-Won Lee, Hyun Joo Kim | 2014-11-04 |
| 8829657 | Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor package | Hyun Joo Kim, Kang-Won Lee | 2014-09-09 |