Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569216 | Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor package | Gyu Jei LEE, Jong Hoon Kim, Tae Hun Yi | 2023-01-31 |
| 9773756 | Semiconductor packages including molded stacked die with terrace-like edges | Jong Kyu MOON, Jong Won Kim | 2017-09-26 |
| 9595499 | Semiconductor devices having through electrodes, methods of manufacturing the same, and semiconductor packages including the same | — | 2017-03-14 |
| 9158081 | Semiconductor package with an optical signal path, memory card including the same, and electronic system including the same | Tae Ho Jo, Taek Joong Kim, Sung Su Park | 2015-10-13 |
| 9159689 | Semiconductor devices having through electrodes, methods of manufacturing the same, and semiconductor packages including the same | — | 2015-10-13 |